高通公司正在为亚马逊网络服务（AWS）设计定制芯片，专注于人工智能推理，并利用AWS Bedrock服务加速芯片设计。双方还合作开发高达1.6太比特的光互连技术，以应对AI基础设施中不断增长的数据流量。高通凭借其在节能芯片设计方面的经验，而亚马逊则贡献其云基础设施。高通利用AWS服务如Amazon Bedrock来加速其芯片设计流程，这是高通自6月以来获得的第三个大型数据中心合同。
要点：
1. 高通为AWS设计定制AI推理芯片，覆盖多代产品。
2. 双方合作开发1.6太比特的光互连技术，以应对AI基础设施的数据流量。
3. 高通利用AWS服务Amazon Bedrock加速芯片设计。
4. 高通目标是到2029年实现150亿美元的数据中心收入。
5. AWS将高通的设计加入其Trainium、Graviton和Nitro芯片系列，以应对推理工作负载。
Qualcomm is designing custom chips for AWS across multiple product generations, with a focus on AI inference. The two companies are also working on optical interconnects with bandwidth up to 1.6 terabits to handle the growing data traffic in AI infrastructure. Qualcomm brings its track record in power-efficient chip design, while Amazon contributes its cloud infrastructure. In return, Qualcomm uses AWS services like Amazon Bedrock to speed up its chip design process.
Amazon is Qualcomm's third big data center win since June. Meta is taking the Dragonfly C1000 server processor, and Microsoft is deploying Qualcomm's HBC memory architecture in Azure. Qualcomm aims to hit $15 billion in data center revenue by 2029.
AWS is adding Qualcomm's designs alongside its own Trainium, Graviton, and Nitro chip families. The move targets inference workloads, where energy cost per token drives the bottom line. Efficiency is also Qualcomm's focus at the other end of the stack, on edge devices. In March, Qualcomm's AI research division released a framework that runs reasoning models on smartphones.
Qualcomm
原始发布方：The Decoder：AI News（RSS）
原文时间：2026-09-09 20:27:42 +08:00
